Mfg Part Number: S8223F 883C
Alternate P/N: S8223F883C
NSN : 5962-01-032-7941
NIIN : 010327941
CAGE Code : 06424
Manufacturer: Alliant Techsystems Operations Llc
Item Name : Microcircuit Memory
In our inventory, we have more than two billion new and obsolete NSN part like S8223F 883C. Aviation Sphere can offer an impressive selection of NSN parts. This includes parts like S8223F 883C Microcircuit Memory from manufacturer Alliant Techsystems Operations Llc and many more, all of which are available with short lead times and competitive prices. For parts not in our inventory, our dedicated account managers can help you track them down through our international supply chain network that extends across the United States, Canada, and the United Kingdom. Furthermore, Aviation Sphere is an AS9120B, ISO 9001:2015, and FAA AC 0056B accredited business, as well as the only independent distributor with a strict No China Sourcing Pledge, allowing us to ensure that each part part like S8223F 883C, you purchase from us is fully traceable or comes directly from its manufacturer.
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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-032-7941 Item Description: Microcircuit Memory | 5962 | 010327941 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | U | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
S8223f 883c | 2 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.896 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | BLDG BLOCK 57 FSCM 30003 |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND BIPOLAR AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND EXPANDABLE AND HIGH SPEED AND WIRE-OR OUTPUTS |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 06424-10842 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWIN |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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