Mfg Part Number: DMS 84124B
Alternate P/N: DMS84124B
NSN : 5962-01-043-1614
NIIN : 010431614
CAGE Code : 34335
Manufacturer: Advanced Micro Devices Inc
Item Name : Microcircuit Memory
In our inventory, we have more than two billion new and obsolete NSN part like DMS 84124B. Aviation Sphere can offer an impressive selection of NSN parts. This includes parts like DMS 84124B Microcircuit Memory from manufacturer Advanced Micro Devices Inc and many more, all of which are available with short lead times and competitive prices. For parts not in our inventory, our dedicated account managers can help you track them down through our international supply chain network that extends across the United States, Canada, and the United Kingdom. Furthermore, Aviation Sphere is an AS9120B, ISO 9001:2015, and FAA AC 0056B accredited business, as well as the only independent distributor with a strict No China Sourcing Pledge, allowing us to ensure that each part part like DMS 84124B, you purchase from us is fully traceable or comes directly from its manufacturer.
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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-043-1614 Item Description: Microcircuit Memory | 5962 | 010431614 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | U | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Dms 84124b | 2 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.180 INCHES MINIMUM AND 1.220 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.100 INCHES MINIMUM AND 0.140 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 2.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 85.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/ENABLE AND W/BUFFERED OUTPUT AND PROGRAMMABLE AND PROGRAMMED AND EXPANDABLE AND W/DECODED OUTPUT AND 3-STATE OUTPUT AND WIRE-OR OUTPUTS AND HIGH SPEED |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 48.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 28815-17-123497 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DR |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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